Detailed information:

GD32F150xx main feature

ARM® ARM ® CortexTM-M3 Core

· Frequency up to 72 MHz

· Flash access zero wait state

· Single-cycle multiplier and hardware divider

  NVIC support 16 internal & 60 external interrupts,
  each has 16 priority levels

Memories

· Flash size from 16KB to 64 KB

· SRAM size from 4KB to 8 KB with HW parity checking

· 3KB ISP loader ROM

Low power management

· Power saving mode: sleep, deep-sleep & standby mode

· Independent battery supply for real-calendar RTC and backup register

Advanced analog peripherals

· 1 x 12bit,
1μs ADC (up to 16 chs)

· 1 x 12-bit DAC

· 2 x fast rail-to-rail low-power comparators

Integrated peripherals interface

· Up to 2 x USART/UART/Irda/LIN/ISO7816

· Up to 2 x SPI (18Mbit/s), 1 x I2S multiplexed

· Up to 2 x I2C (400Kbit/s)

· USB 2.0 FS (12Mbit/s)

· HDMI-CEC

On-chip resources

· 1 x 16 bit Advanced Timer, 1 x SysTick Timer,
  5 x 16 bit GPTM, 1x 32bit GPTM, 1 x Basic Timer,
  2 x WDG

· 5-chs DMA support: Timers, ADC, SPIs, I2Cs, USARTs, DAC and I2Ss

· System supervisor and reset: POR,PDR,LVD

· 80% GPIO available

· 32-bit CRC & 96-bit unique ID

· On-chip clock: HSI (8MHz), LSI (40KHz)

· System supervisor and reset:
  POR,PDR,LVD

  Touch sensing interface (TSI, supports up to 18 external electrodes)

Package

· TSSOP20 (6.5 x 4.4 x 1mm)

· QFN32 (5 x 5 x 0.75mm)

· LQFP48(7 x 7 x 1mm)

· LQFP64 (10 x 10 x 1.4mm)